Journal: Micromachines

Article Title: A Resonant Pressure Microsensor with a Wide Pressure Measurement Range

doi: 10.3390/mi12040382

Figure Lengend Snippet: ( a ) The stress distribution on sensing elements under pressure; ( b ) the working principle of the resonator; ( c ) the working principle of the presented microsensor.

Article Snippet: To verify the design of the microsensor, FEA simulations based on ANSYS were employed to evaluate the maximum stress on the microsensors with two different pressure-sensitive diaphragms.

Techniques:

Journal: Micromachines

Article Title: A Resonant Pressure Microsensor with a Wide Pressure Measurement Range

doi: 10.3390/mi12040382

Figure Lengend Snippet: ( a ) Structural simulations under 7000 kPa: ( a ) the microsensor with square pressure-sensitive diaphragm (side length of 4.4 mm); ( b ) the microsensor with circular pressure-sensitive diaphragm (diameter of 4.4 mm).

Article Snippet: To verify the design of the microsensor, FEA simulations based on ANSYS were employed to evaluate the maximum stress on the microsensors with two different pressure-sensitive diaphragms.

Techniques:

Journal: Micromachines

Article Title: A Resonant Pressure Microsensor with a Wide Pressure Measurement Range

doi: 10.3390/mi12040382

Figure Lengend Snippet: Dimensional information of the microsensor model in FEA simulations.

Article Snippet: To verify the design of the microsensor, FEA simulations based on ANSYS were employed to evaluate the maximum stress on the microsensors with two different pressure-sensitive diaphragms.

Techniques:

Journal: Micromachines

Article Title: A Resonant Pressure Microsensor with a Wide Pressure Measurement Range

doi: 10.3390/mi12040382

Figure Lengend Snippet: The fabrication results: ( a ) top view of the “H” resonant beam; ( b ) an SEM cross-section image of the microsensor; ( c ) top view of the microsensor and ( d ) side view of the microsensor.

Article Snippet: To verify the design of the microsensor, FEA simulations based on ANSYS were employed to evaluate the maximum stress on the microsensors with two different pressure-sensitive diaphragms.

Techniques:

Journal: Micromachines

Article Title: A Resonant Pressure Microsensor with a Wide Pressure Measurement Range

doi: 10.3390/mi12040382

Figure Lengend Snippet: ( a ) The cross-section image of the resonant pressure sensor’s packaging concept; ( b ) an image of the packaged microsensor.

Article Snippet: To verify the design of the microsensor, FEA simulations based on ANSYS were employed to evaluate the maximum stress on the microsensors with two different pressure-sensitive diaphragms.

Techniques:

Journal: Micromachines

Article Title: Persistent Effect Test and Internal Microscopic Monitoring for PEM Water Electrolyzer

doi: 10.3390/mi12050494

Figure Lengend Snippet: Process diagram of flexible 6-in-1 microsensor.

Article Snippet: This study uses MEMS technology to develop an electrochemical environment resistant flexible 6-in-1 microsensor, the micro voltage, current, temperature, humidity, flow and pressure sensors are successfully integrated on a 50 μm thick Polyimide (PI) film substrate, and the PI (Fujifilm Durimide ® PI 9320) resistant to the corrosion of electrochemical environment is used as a protection layer.

Techniques:

Journal: Micromachines

Article Title: Persistent Effect Test and Internal Microscopic Monitoring for PEM Water Electrolyzer

doi: 10.3390/mi12050494

Figure Lengend Snippet: Optical micrograph of 6-in-1 microsensor.

Article Snippet: This study uses MEMS technology to develop an electrochemical environment resistant flexible 6-in-1 microsensor, the micro voltage, current, temperature, humidity, flow and pressure sensors are successfully integrated on a 50 μm thick Polyimide (PI) film substrate, and the PI (Fujifilm Durimide ® PI 9320) resistant to the corrosion of electrochemical environment is used as a protection layer.

Techniques: